| Base Material: | FR4,Tg130℃-Tg170℃,Aluminim base,copper base.Rogers etc. |
| Min/Max Number of Layers: | 1 to 20 layers |
| Max Dimension of Board: | 864X610mm (24inch*34inch) |
| Min/Max Final Thickness Board: | 0.2-7.0mm |
| Copper Foil Thickness: | 0.5 OZ to 20 OZ |
| Finished Surface: | HASL,LF HASL,Immersion Gold, Immersion Silver, Immersion Tin, Gold Finger, Flash God, OSP |
| Impedance control | +/- 10% |
| Solder Mask (colors): | Green,Red,Yellow,White,Black,Blue,etc |
| Silkscreen (colors): | White,Black |
| Mini Line Width/Space: | 3mil/3mil |
| G/F Au thickness: | 50u” max |
| Min finished hole size: | 6mil/0.15mm |
| Max Aspect ratio: | 12:1 |
| Minimum Annular Ring: | 12mil |
| Via hole type: | Buried, blind.Plugged.Via in pad |
| Outline finish type: | CNC routing, Punch, V-score |
| Min.soldermask opening: | 0.05mm (2mil) |
| Min.soldermask coverage: | 0.05mm (2mil) |
